发明名称 IRIDIUM PLATING SOLUTION AND PLATING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an iridium plating solution by which an iridium plated film prevented from the occurrence of crack as possible is easily formed, and to provide a plating method thereof. SOLUTION: The iridium plating solution uses an iridium compound obtained by adding and stirring one or more compounds selected from a group comprising saturated monocarboxylic acid, saturated monocarboxylate, saturated dicarboxylic acid, saturated dicarboxylate, saturated hydroxy carboxylic acid, saturated hydroxy carboxylate, amide and urea in an iridium(III) complex in which an anion component is halogen, wherein one or more kinds of Fe, Co, Ni and Cu are contained. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248552(A) 申请公布日期 2010.11.04
申请号 JP20090097657 申请日期 2009.04.14
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 ITO MASAHIRO
分类号 C25D3/56;C25D3/50 主分类号 C25D3/56
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