摘要 |
PROBLEM TO BE SOLVED: To provide an iridium plating solution by which an iridium plated film prevented from the occurrence of crack as possible is easily formed, and to provide a plating method thereof. SOLUTION: The iridium plating solution uses an iridium compound obtained by adding and stirring one or more compounds selected from a group comprising saturated monocarboxylic acid, saturated monocarboxylate, saturated dicarboxylic acid, saturated dicarboxylate, saturated hydroxy carboxylic acid, saturated hydroxy carboxylate, amide and urea in an iridium(III) complex in which an anion component is halogen, wherein one or more kinds of Fe, Co, Ni and Cu are contained. COPYRIGHT: (C)2011,JPO&INPIT
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