发明名称 METHOD OF MANUFACTURING CASE-MOLDED CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case-molded capacitor which has high moisture resistance and is highly reliable even when used under hard conditions, for example, during on-board use. SOLUTION: A method of manufacturing the case-molded capacitor includes steps of: molding a fixed plate 12 with a support portion 12a, and a plurality of terminals 11 in one body; connecting a capacitive element 13 to an element connection portion 11a as one end of a terminal 11; fixing the fixed plate 12 to an inner wall surface of a case 14 by the support portion 12a near an opening 14a; injecting a filling resin 16 through a gap 15 between the fixed plate 12 and the inner wall surface of the case 14 so that an upper surface of the fixed plate 12 is exposed from a surface of the filling resin 16; and curing the filling resin 16. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010251399(A) 申请公布日期 2010.11.04
申请号 JP20090096847 申请日期 2009.04.13
申请人 PANASONIC CORP 发明人 MIURA TOSHIHISA;SAITO TOSHIHARU;IMAMURA TAKESHI
分类号 H01G4/224;H01G4/18 主分类号 H01G4/224
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