发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting device in which a heat radiation effect can be improved by efficiently radiating heat generated by the light emitting device, and which is available as a display device for a long time without causing the peeling of a metal layer from the inner surface of a recess. <P>SOLUTION: In the package for housing the light emitting device, a plurality of recesses 4 for housing light emitting devices 3 are longitudinally and transversely arrayed on the upper surface of an insulating substrate 1, and grooves 8 are disposed, respectively, between the recesses 4 on the upper surface and the lower surface of the insulating substrate 1. The grooves 8 on the upper surface are arranged parallel to one another, and the grooves 8 on the lower surface are arranged parallel to one another in a direction different from those of the grooves 8 on the upper surface. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP4574694(B2) 申请公布日期 2010.11.04
申请号 JP20080107694 申请日期 2008.04.17
申请人 发明人
分类号 H01L33/48;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/48
代理机构 代理人
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