| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi piece producing wiring board excellent in productivity of a wiring board in an individual piece state, in which a workability at dividing a mother board in a boundary of wiring board areas is good. SOLUTION: The multi piece producing wiring board 9 is constituted by lengthwisely and breadthwisely arranging and forming multiple wiring board areas 2 in a mother board 1 made of a ceramic sinter and is cut in a boundary 2b of the wiring board areas 2 by a dicing processing. In the boundary 2b of the wiring board areas 2 of the mother board 1, there are formed multiple through-holes 5 having a smaller width than a band-like part C cut by the dicing processing of the mother board 1 and piercing the mother board 1 in the thickness direction so that a part thereof may be sequentially overlapped in the width direction (W) of the band-like part C. Since a width of the mother board 1 actually cut by the dicing processing becomes smaller, a cutting speed can be accelerated while suppressing generation of a chip or the like, and it is possible to make the multi piece producing wiring board 9 excellent in productivity of the wiring board in the individual piece state. COPYRIGHT: (C)2011,JPO&INPIT |
