| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a seal type device in which a gas molecule absorbing material (getter) need not be arranged in a sealing space and a degree of vacuum in the sealing space can be adjusted to a desired one without increasing a manufacturing process, and to provide a method of manufacturing the device. <P>SOLUTION: The seal type device has a cavity formed in a semiconductor substrate and seals the cavity by at least one glass substrate. The device is provided with a first groove formed to lead to the cavity, a second groove formed to lead to a dicing line of the seal type device, a first projection which is formed separately from the first groove and forms a gap in a bonding part of the semiconductor substrate and the glass substrate, and a second projection which is formed separately from the second groove and forms the gap in the bonding part of the semiconductor substrate and the glass substrate. Gas in the cavity is exhausted through the first groove, the second groove, the gap and the dicing line to allow the degree of vacuum to be adjusted to the desired one. <P>COPYRIGHT: (C)2011,JPO&INPIT |
