发明名称 |
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE |
摘要 |
<p>A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.</p> |
申请公布号 |
WO2010126160(A1) |
申请公布日期 |
2010.11.04 |
申请号 |
WO2010JP57844 |
申请日期 |
2010.04.27 |
申请人 |
YAZAKI CORPORATION;SAWAI, MAMORU |
发明人 |
SAWAI, MAMORU |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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