| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a CoC-type semiconductor device capable of suppressing rupture of connection sections of semiconductor chips and occurrence of cracks in the semiconductor chips. <P>SOLUTION: A chip laminate is created by stacking a plurality of semiconductor chips 10 while connecting respective through electrodes 13 of the semiconductor chips 10 to each other, and forming a first sealing resin layer 14 for covering the periphery of the plurality of stacked semiconductor chips, and filling gaps between the semiconductor chips. Subsequently, the chip laminate is fixed on a support substrate or a wiring board 20 formed with prescribed wiring. <P>COPYRIGHT: (C)2011,JPO&INPIT |
