发明名称 INSULATION PAPER WITH HIGH THERMAL CONDUCTIVITY MATERIALS
摘要 The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
申请公布号 US2010276628(A1) 申请公布日期 2010.11.04
申请号 US20100837582 申请日期 2010.07.16
申请人 SMITH JAMES D;STEVENS GARY;WOOD JOHN W 发明人 SMITH JAMES D.;STEVENS GARY;WOOD JOHN W.
分类号 C09K5/14;D21H13/44;D21H17/67;H01B3/52;H01B3/54 主分类号 C09K5/14
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