发明名称 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME
摘要 A method for adsorbing a catalyst, including: a step of applying, to a substrate, a photocurable composition which contains a compound having a polymerizable group and a group that is interactive with a plating catalyst or a precursor thereof, and that, when photo-cured, forms a surface-hydrophobic cured material satisfying the following Requirements 1 and 2; a step of curing the curable composition by pattern-wise exposure, a step of removing uncured materials by development; and a step of bringing an aqueous plating catalyst solution containing a plating catalyst or a precursor thereof and an organic solvent into contact with the substrate, wherein when a palladium-containing test liquid is brought into contact with the substrate having the patterned surface-hydrophobic cured material layer formed thereon, A mg/m2 and B mg/m2, which respectively refer to a palladium adsorption in an area having the surface-hydrophobic cured material layer formed thereon and a palladium adsorption in an area not having the surface-hydrophobic cured material layer formed thereon, satisfy the following relationship Formulae (A) and (B): Requirement 1: saturated water absorption under the conditions of 25° C. and a relative humidity of 50% is from 0.01 to 5% by mass, Requirement 2: saturated water absorption under the conditions of 25° C. and a relative humidity of 95% is from 0.05 to 10% by mass, 10 mg/m2≦̸A≦̸150 mg/m2  Formula (A) 0 mg/m2≦̸B≦̸5 mg/m2.  Formula (B)
申请公布号 US2010279012(A1) 申请公布日期 2010.11.04
申请号 US20080810806 申请日期 2008.12.05
申请人 FUJIFILM CORPORATION 发明人 SATO MASATAKA
分类号 B05D3/10;B01J21/02;B01J23/44;B01J23/50;B01J23/72;B01J23/745;B01J23/75;B01J23/755;B05D5/00 主分类号 B05D3/10
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