发明名称 MOLD RELEASE COMPOSITION AND SURFACE PROTECTIVE FILM
摘要 <p>Provided is a mold release composition, with which it is possible to form a transparent coating on the surface of which a photoresist cannot be readily deposited. Also provided is a surface protective film having a coating formed from the cured product of the mold release composition. The mold release composition comprises a binder resin, a silicone oil, and a metal alkoxide hydrolysis product. Preferably the metal alkoxide hydrolysis product content is 50 to 500 parts by weight per 100 parts by weight of binder resin. Preferably the metal alkoxide consists of tetraethoxysilane or tetramethoxysilane. The surface protective film is obtained by forming a coating of the cured product of the mold release composition on a substrate.</p>
申请公布号 WO2010125933(A1) 申请公布日期 2010.11.04
申请号 WO2010JP56849 申请日期 2010.04.16
申请人 KIMOTO CO., LTD.;HASEGAWA, TAKESHI;SHIBUYA, TAKASHI;ARAI, HIROYUKI;KURISHIMA, SUSUMU 发明人 HASEGAWA, TAKESHI;SHIBUYA, TAKASHI;ARAI, HIROYUKI;KURISHIMA, SUSUMU
分类号 C08L101/00;C08K5/057;C08L83/04;C09D183/04;C09D185/00;C09D201/00;G03F1/14 主分类号 C08L101/00
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