Chip assembly module of bump connection type using a multi-layer printed circuit substrate

摘要

A multi-layer structured printed circuit substrate (50) having an upper conductive layer (51) and a lower conductive layer (52) with an inter-layer insulating layer (53) is used. A chip assembly part (23) of bump connection type is formed by forming openings (51A, 53A) in a portion of the upper conductive layer and the inter-layer insulating layer in order to expose the lower conductive layer. A bear chip (10) is buried in the chip assembly part for assembly. A sealing member (60) is filled in the lower space of the bear chip. A flat plate type radiating plate (80) having an opening (81) corresponding to the chip assembly part is located on the substrate and a heat conductive adhesive (90) is filled between said radiating plate and the bear chip.