BACKSIDE ILLUMINATED IMAGING SENSOR HAVING A CARRIER SUBSTRATE AND A REDISTRIBUTION LAYER
摘要
<p>A backside illuminated imaging sensor includes a semiconductor substrate having a front surface and a back surface. The semiconductor substrate has at least one imaging array formed on the front surface. The imaging sensor also includes a carrier substrate to provide structural support to the semiconductor substrate, where the carrier substrate has a first surface coupled to the front surface of the semiconductor substrate. A re-distribution layer is formed between the front surface of the semiconductor substrate and the second surface of the carrier substrate to route electrical signals between the imaging array and a second surface of the carrier substrate.</p>
申请公布号
EP2245665(A1)
申请公布日期
2010.11.03
申请号
EP20080872211
申请日期
2008.12.23
申请人
OMNIVISION TECHNOLOGIES, INC.
发明人
TAI, HSIN-CHIH;RHODES, HOWARD, E.;MAO, DULI;VENEZIA, VINCENT;QIAN, YIN