发明名称 |
Method of manufacturing printed circuit board |
摘要 |
A method of manufacturing a printed circuit board is disclosed. The method includes: forming a relievo pattern and an intaglio pattern on a surface of a base plate; forming a metal plate, which has a metal pattern that corresponds with a shape of the relievo pattern and the intaglio pattern, by plating a surface of the relievo pattern and a surface of the intaglio pattern; separating the metal plate from the base plate; pressing the metal plate onto an insulation layer with the metal pattern facing the insulation layer; and removing a portion of the metal plate such that the metal pattern is exposed. Since this method does not use carriers, there is no need for a chemical etching process for carrier removal.
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申请公布号 |
US7824838(B2) |
申请公布日期 |
2010.11.02 |
申请号 |
US20080068125 |
申请日期 |
2008.02.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JO JI-HONG;OKABE SHUHICHI |
分类号 |
G03F7/00;G03F7/26;G03F7/40 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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