Junction temperature junction quantifying method for e.g. diode, involves measuring temperature of environment of electric/electronic component by temperature sensors, where environment is constituted of given temperature case

摘要

The method involves measuring temperature (Ta) of environment of an electric/electronic component by temperature sensors (5, 7). The environment is constituted of a given temperature case containing the component. Dissipated power in the component is estimated according to the temperatures of the case and ambient air, according to a current (Ic) and a voltage (Uc) applied to a junction and according to thermal resistance (RTHjb) and other thermal resistance respectively between a junction and ambient air and between a case and the ambient air. An independent claim is also included for a system for quantifying temperature of a junction of an electric/electronic component, including a calculation device.