IMBEDDED PRINTED CIRCUIT BOARD WITHIN WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: The wiring layer is formed selectively on the part embedded printed circuit board equipped with the redistribution layer and the layer in which the manufacturing method thereof silver part is mounted. CONSTITUTION: The part element is fixed to the redistribution layer(10) through the solder paste(40). In the bottom surface of the redistribution layer, the low dielectric substance layer(20) is arranged. The low dielectric substance layer is formed into the epoxy. The inner isolation layer(50) is formed at the upper part of the part element and low dielectric substance layer.