| 摘要 |
PROBLEM TO BE SOLVED: To provide an enclosure mount paper for fixing an IC card with measures taken not to damage an IC module by a "mail sorting machine" when mailing the IC card to a user. SOLUTION: This enclosure mount paper 10 is used for enclosing and mailing a contact type or contact/non-contact type IC card 1 in a state of fixing an IC module portion of the IC card 1 to the IC card enclosure mount paper 10 with a re-peelable soft adhesive 3 or a double coated adhesive tape or in a state of fixing the IC module portion with the re-peelable soft adhesive 3 or double-coated adhesive tape excluding a portion of an IC chip 2 position of the IC module. The soft adhesive 3 or double-coated adhesive tape has an effect of relieving pressure caused by a "mail sorting machine roller" of narrow width. COPYRIGHT: (C)2011,JPO&INPIT |
