发明名称 |
HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE HEAT TRANSPORT DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat transport device capable of efficiently performing heat transport, an electronic apparatus including the heat transport device and a highly reliable method of manufacturing the heat transport device facilitating manufacturing. <P>SOLUTION: A heat spreader 1 includes a container 2 constituted of a heat receiving plate 4, a heat radiation plate 3 provided opposing to the heat receiving plate 4, and side walls 5 for airtightly jointing the heat receiving plate 4 and the heat radiation plate 3 to each other. A refrigerant is filled in the container 2. An evaporation portion 7 is provided on an evaporation face 42 of the heat receiving plate 4 constituting the inner wall face of the container 2. The evaporation portion 7 includes: grooves 71 in which a liquid-phase refrigerant can be moved; and protrusion portions 75 made of a nanomaterial protruded from inner wall faces 72 of the grooves 71 so as to partially cover opening faces of the grooves 71. The liquid-phase refrigerant is made to flow in liquid-phase flow passages 74 formed within the grooves 71. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010243035(A) |
申请公布日期 |
2010.10.28 |
申请号 |
JP20090091215 |
申请日期 |
2009.04.03 |
申请人 |
SONY CORP |
发明人 |
HASHIMOTO MITSUO;YAZAWA KAZUAKI;KASAI HIROTO;ISHIDA YUICHI;YOSHITAKA HIROYUKI |
分类号 |
F28D15/02;H01L23/427;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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