发明名称 METHOD OF MOUNTING TRANSPARENT COMPONENT
摘要 PROBLEM TO BE SOLVED: To precisely mount a transparent component at an object position on a substrate using a surface-mounting machine. SOLUTION: A transparent component includes two or more portions where a thickness in the vertical direction is configured to be thickly or thinly formed locally. The transparent component held by a mount head 5 is photographed from the upper face side or lower face side by a components recognition camera 4 while being radiated by a single or a plurality of spot lights 7a. Then, two or more portions appear locally having different brightness. By extracting these portions as characteristic points, the holding state of the transparent component is recognized, so that it is possible to mount the component at the object position of a substrate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010245467(A) 申请公布日期 2010.10.28
申请号 JP20090095515 申请日期 2009.04.10
申请人 SIIX CORP 发明人 MATSUSHIMA YOSHIHIKO;KAWAKAMI TADASHI;IMAI TORU;MONTIAN TOUENCHAROON
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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