发明名称 PATTERN FORMING METHOD, POSITIVE RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, DEVELOPER FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for stably forming a high-precision fine pattern for use in a process of producing a semiconductor such as an IC, in a production of a circuit board for a liquid crystal, a thermal head and the like, and in other photofabrications, and to provide a resin composition used for the method, a developer for the method, and a rinsing solution for negative development used in the method. <P>SOLUTION: The pattern forming method includes: (I) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (II) exposing the resist film; and (III) developing the resist film with a negative developer. The invention also provides a positive resist composition for multiple-development used in the method, a developer for use in the method, and a rinsing solution for negative development used in the method. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010244062(A) 申请公布日期 2010.10.28
申请号 JP20100123583 申请日期 2010.05.28
申请人 FUJIFILM CORP 发明人 TSUBAKI HIDEAKI;KANNA SHINICHI
分类号 G03F7/30;C08F214/14;C08F220/26;G03F7/038;G03F7/039;G03F7/32;G03F7/38;H01L21/027 主分类号 G03F7/30
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