| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency module which has sufficient shielding properties and heat-releasing properties, can easily be miniaturized and thinned and can inexpensively be manufactured without accumulation of a void inside in a manufacture process; and to provide a method of manufacturing the module. <P>SOLUTION: In the method of manufacturing the high-frequency module, circuit patterns and electronic components 5 and 6 are arranged in respective unit sections 2 on a main face 4a of a substrate 4 having a plurality of unit sections 2. Resin molding 7 is applied on them. Respective crossing grooves are formed between the unit sections 2 to a part where ground patterns 3 buried between the unit sections 2 of the substrate 4 are exposed. The groove is filled with conductive paste in a half direction of an angle where the groove directions cross. Paste is applied onto the main face 4a of the substrate 4, heated, cured and is connected to the ground pattern 3 exposed to the groove. The substrate 4 is divided into the plurality of unit sections 2 by layers of the conductive paste with which the grooves are filled. <P>COPYRIGHT: (C)2011,JPO&INPIT |
