发明名称 APPARATUS AND METHOD FOR POLISHING
摘要 PROBLEM TO BE SOLVED: To further reduce consumption of a polishing liquid while keeping a relatively high polishing rate. SOLUTION: An apparatus of polishing includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W while pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 connected with a polishing liquid supply line 72 for supplying a polishing liquid Q to the polishing surface 52a; a polishing liquid amount monitor means 60 for monitoring a polishing liquid amount on the polishing surface 52a during polishing; and a liquid amount adjusting part 74 for adjusting the amount of the polishing liquid Q supplied from the polishing liquid supply nozzle 26 to the polishing surface 52a in response to an output from the polishing liquid amount monitor means 60. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010240752(A) 申请公布日期 2010.10.28
申请号 JP20090089068 申请日期 2009.04.01
申请人 EBARA CORP 发明人 ISHII YU;SHIOKAWA YOICHI;HIRAANA TSUNEHITO
分类号 B24B37/00;B24B57/02;H01L21/304 主分类号 B24B37/00
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