发明名称 |
APPARATUS AND METHOD FOR POLISHING |
摘要 |
PROBLEM TO BE SOLVED: To further reduce consumption of a polishing liquid while keeping a relatively high polishing rate. SOLUTION: An apparatus of polishing includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W while pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 connected with a polishing liquid supply line 72 for supplying a polishing liquid Q to the polishing surface 52a; a polishing liquid amount monitor means 60 for monitoring a polishing liquid amount on the polishing surface 52a during polishing; and a liquid amount adjusting part 74 for adjusting the amount of the polishing liquid Q supplied from the polishing liquid supply nozzle 26 to the polishing surface 52a in response to an output from the polishing liquid amount monitor means 60. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010240752(A) |
申请公布日期 |
2010.10.28 |
申请号 |
JP20090089068 |
申请日期 |
2009.04.01 |
申请人 |
EBARA CORP |
发明人 |
ISHII YU;SHIOKAWA YOICHI;HIRAANA TSUNEHITO |
分类号 |
B24B37/00;B24B57/02;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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