发明名称 |
METAL PARTICULATE, PLATING SOLUTION, LEAD WIRE AND RELATED METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for working various metals into desired shapes and forming coating films of various metals at a low temperature equal to or under a melting point of the metal, without impairing the electroconductivity and also without using a poisonous material such as a cyanide. SOLUTION: Plating or powder coating is performed by using metal particulates which are each covered with a monomolecular film of a chemical adsorption material having a reactive group on the outermost surface. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010242136(A) |
申请公布日期 |
2010.10.28 |
申请号 |
JP20090089903 |
申请日期 |
2009.04.02 |
申请人 |
OGAWA KAZUFUMI |
发明人 |
OGAWA KAZUFUMI |
分类号 |
C25D15/02;B05D1/18;B22F1/00;B22F1/02;B22F9/00;B82B1/00;B82B3/00;C23C18/52;C23C24/00;C25D13/00;H01B5/00;H01B13/00 |
主分类号 |
C25D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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