| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer which cuts and removes a chamfered part of a wafer while frequency of replacement and correction of a cutting blade can be reduced. SOLUTION: The processing method includes: a step for mounting the cutting blade 24 of a thickness, as large as or less than twice of a radial distance of a region to be removed, on a spindle 10; a step for corresponding and holding a center of the wafer 2 to a rotary shaft on a chuck table 20; a step for positioning a first side surface of the cutting blade 24 having a first and second side surfaces on one of two intersections of projection of an axis of the spindle 10 and a circular inner circumferential edge of the region to be removed; a step for making the cutting blade 24 cut into a wafer 2; a step for removing the region to be removed by rotating the chuck table 20 by 360 degrees; and a step for positioning the second side surface in the other one of the two intersections as positioning of the cutting blade 24 in the cutting step at a predetermined timing. COPYRIGHT: (C)2011,JPO&INPIT
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