| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove minor foreign matters not fixed firmly from a substrate to be used in a semiconductor aligner. <P>SOLUTION: A feeding hand and a wafer chuck are provided with a mechanism for microscopically vibrating the feeding hand and the wafer chuck in the Z direction. When sucking a wafer, the feeding hand and the wafer chuck suck wafer while imparting blowing and microvibration to the wafer during sucking action. <P>COPYRIGHT: (C)2011,JPO&INPIT |
