| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for fabricating a heat-radiation substrate inexpensive in material costs and process costs, capable of achieving light, thin, short, and small dimensions, and excellent in reliability and processability, capable of enlarging its area, by introducing a plastic substrate excellent in thermal conductivity to improve heat-radiating characteristics. <P>SOLUTION: This heat-radiation substrate 100 having a hybrid layer comprises the hybrid layer 300 including a thermoplastic polymer and an electroconductive filler, an insulation layer 500 formed on the hybrid layer 300, and a metal layer 700 formed on the insulation layer 500. <P>COPYRIGHT: (C)2011,JPO&INPIT |
