METHOD OF MANUFACTURING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that is superior in shape accuracy in a conductor layer. SOLUTION: The method includes process A for preparing an insulator layer and process B for forming a specified conductor layer in the insulator layer. The process B includes: a first step of preparing a first mold having on its lower surface a projection corresponding to the shape of the specified conductor layer; a second step of forming a housing area for the specified conductor layer by pressing the first mold onto the insulator layer; a third step of printing a conductor paste to the insulator layer so as to form a conductor layer; a fourth step of preparing a second mold having on its lower surface a mold for a groove corresponding to the shape of the specified conductor layer; a fifth step of forming the specified conductor layer by pressing the second mold onto the conductor layer; and a sixth step of forming the specified conductor layer in the insulator layer by removing a part of the conductor layer. COPYRIGHT: (C)2011,JPO&INPIT