发明名称 |
APPARATUS FOR BONDING FPC |
摘要 |
PURPOSE: An FPC bonding apparatus for automatically inserting the FPC between touch panels and bonding the same is provided to improve the work efficiency due to automatically inserting the FPC between touch panels and bonding the FPC. CONSTITUTION: An ACF bonding unit(1) attaches an anisotropic conductive film on the up/down side of an FPC. An FPC stage(37) inserts the FPC to the interval between the lower plate and the upper plate. The panel stage transfers the panel to the bonding location. The upper plate and the lower plate of the panel in which a panel jaw is settled in the panel stage are opened to the top and bottom. |
申请公布号 |
KR20100115207(A) |
申请公布日期 |
2010.10.27 |
申请号 |
KR20090033827 |
申请日期 |
2009.04.17 |
申请人 |
SEKWANG TECHNOLOGIES CO., LTD. |
发明人 |
KIM, KWANG WOO |
分类号 |
G02F1/1345;G02F1/13 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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