发明名称 |
Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards |
摘要 |
A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
|
申请公布号 |
US7821790(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20070728718 |
申请日期 |
2007.03.26 |
申请人 |
SLT LOGIC, LLC |
发明人 |
SHARMA VISWA N.;CHU WILLIAM;JAMES ALLEN D.;TSENG MING SIU;SCHLEGEL NEIL;LENTZ DAVID;SONNEK CHRISTOPHER D. |
分类号 |
H05K7/16;H05K5/00;H05K7/00 |
主分类号 |
H05K7/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|