| 摘要 |
A semiconductor device including a multi-layer interconnection substrate having a signal distribution interconnection and a power supply line and semiconductor circuit blocks installed on the multi-layer interconnection substrate for performing required operations. The multi-layer substrate includes a third interconnection layer having interconnections extending in a first direction, a second interconnection layer having interconnections extending in a second direction which is different to the first direction, and a first interconnection layer having interconnections extends in a direction orthogonal to the first direction.
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