| 摘要 |
A method of hermetically packaging an electronic device 8, in an enclosure 2 comprising mutually inter-engageable first and second housing members 4, 6, comprising the steps of securing the electronic device 8 to the first housing member 4, engaging the first 4 and second 6 housing members such that an hermetic seal is provided there between, wherein the engagement step is performed in a controlled atmosphere. The hermetic seal may be provided by an interference fit between the first 4 and second 6 housing members or via sealing means 16 interposed between the housing members 4, 6. The second housing member 6 may comprise an optical element (20), for example a window or lens. The packaging method is particularly applicable to packaging thermal detectors, for example microbolometer arrays. |
