发明名称 Prepreg and conductive layer-laminated substrate for printed wiring board
摘要 A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolarα-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolarα-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.
申请公布号 US7820274(B2) 申请公布日期 2010.10.26
申请号 US20070755374 申请日期 2007.05.30
申请人 NOF CORPORATION 发明人 OHTA TOSHIHIRO;YAMADA TOMIHO;ASAMI SHIGERU
分类号 B32B3/00 主分类号 B32B3/00
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