| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a microdevice, in which shape defect such as a crack is prevented by a simple manufacturing process. <P>SOLUTION: The microdevice includes a semiconductor substrate 1 provided with a recessed portion 22 formed on one surface side, and a base 3 which is fixed on the one surface side of the semiconductor substrate 1 and blocks the recessed portion 22. A portion between a bottom surface of the recessed portion 22 of the semiconductor substrate 1 and the other surface side opposite to the one surface side is a thin portion 23, which includes a region 24 for forming a beam portion and a region 25 to be etched, and the region 25 to be etched is etched, and the beam portion 14 is formed in the region 24 for forming the beam portion. The method of manufacturing a microdevice includes a process for forming a mesh-like portion 26 on the thin portion 23 by forming a plurality of through holes 27 penetrating through the thin portion 23 over the entire region 25 to be etched, and a process for forming the beam portion 14 by etching the region 25 to remove the mesh-like portion 26. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
