发明名称 VACUUM NOZZLE CONTROL APPARATUS AND HEAD ASSEMBLY FOR CHIP MOUNTER HAVING THE SAME
摘要 A vacuum nozzle control apparatus and a head assembly for a chip mounter having the same are provided. The vacuum nozzle control apparatus includes a nozzle module having a vacuum hole, a vacuum providing module configured to provide a vacuum to the vacuum hole through a vacuum line, and a vacuum control module configured to selectively form the vacuum in the vacuum hole through the vacuum line, or release the vacuum formed in the vacuum hole through a release line branched off from the vacuum line to expose the vacuum hole to air.
申请公布号 US2010263157(A1) 申请公布日期 2010.10.21
申请号 US20100760691 申请日期 2010.04.15
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM BYUNG-JU
分类号 A47L5/00 主分类号 A47L5/00
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