| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for bonding a semiconductor chip, a cured product of which is low in linear expansion and elastic modulus, while permitting a decrease in generating stresses exerted on a bonded semiconductor chip, to obviate the occurrence of cracks in a conductive portion, such as, solder and produce high-reliability semiconductor devices, and to provide a non-conductive paste and a non-conductive film produced through the use of the adhesive for bonding a semiconductor chip. SOLUTION: The adhesive for bonding the semiconductor chip contains curable compound, curing agent and polyimide particles. COPYRIGHT: (C)2011,JPO&INPIT |
