| 摘要 |
Methods and apparatus for aligning a substrate in a process chamber are provided herein. In some embodiments, an apparatus may include a process chamber having an interior volume for processing a substrate therein; and a substrate positioning system configured to determine a substrate position within the interior volume, wherein the substrate positioning system determines the substrate position in two dimensions by the interaction of a first position and a second position along an edge of a substrate with two beams of electromagnetic radiation provided by the substrate positioning system. In some embodiments, a method for aligning a substrate may include placing a substrate in the interior volume of a process chamber; directing electromagnetic radiation into the interior volume in a first beam along a first path and in a second beam along a second path; and determining the position of the substrate in two dimensions by interaction of the first and second beams of electromagnetic radiation with an edge of the substrate proximate a first position and a second position.
|
