| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire inspection method which enables a wire inspection to be carried out rapidly and surely even if the pixel number of a photographed image is increased. SOLUTION: The wire inspection method which photographs a semiconductor integrated circuit having a wire and detects the existence of a wire defect on the basis of the photographed image, includes a wire image extracting step of extracting a wire image corresponding to the wire from an original image through a median filter processing applied to the original image on the basis of the photographed image. The wire image extracting step includes a median filter frame setting step of determining a relative position between a target pixel P and a reference point C of the original image, and setting one linear median filter frame A on the basis of the relative position. In the median filter frame setting step, the median filter frame A is set in a direction approximately perpendicular to a line heading from the target pixel P to the reference point C. COPYRIGHT: (C)2011,JPO&INPIT
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