| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for combining a flange, a frame, and leads without using an adhesive. <P>SOLUTION: A circuit package 100 for housing semiconductor devices 110 includes a high-copper flange 102, one or more high-copper leads 106, and a liquid crystal polymer frame 104 molded to the flange and the leads. The flange includes a dovetail-shaped groove or other-shaped frame retention feature structure, which mechanically interlocks with the molded frame. The leads include one or more lead retention feature structures to mechanically interlock with the frame. The frame includes compounds to prevent moisture infiltration, and its coefficient of thermal expansion matches the coefficient of thermal expansion of the leads and the flange. The frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange. <P>COPYRIGHT: (C)2011,JPO&INPIT |
