| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that prevents a portion of a pattern of a moisture-resistant ring from peeling, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device has a first moisture-resistant ring 8a and a second moisture-resistant ring 8b, wherein the first moisture-resistant ring has: a first pattern 150a buried in a first insulating layer 142; a second pattern 160a buried in a second insulating layer 156 and narrower in width than the first pattern; and a third pattern 160c formed on the second insulating layer, such that at least one of both side portions along a longitudinal direction does not overlap planarly with the first pattern. The second moisture-resistant ring 8b has: a fourth pattern 150b buried in the first insulating layer; a fifth pattern 160b buried in the second insulating layer and narrower in width than the fourth pattern; and a sixth pattern 162b formed on the second insulating layer, such that at least one of both side portions along the longitudinal direction does not overlap planarly with the fourth pattern, and separated from the third pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT |
