CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING SUBSTRATE, ESTER COMPOUND, AND ESTER-BASED RESIN AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition which has both excellent heat resistance and low dielectric constant and a low dissipation factor and furthermore which attains a good solvent dissolvability; a cured product of the same; a printed wiring substrate which has both heat resistance and a low dielectric constant and low dissipation factor; an ester compound to give these performance; and an ester-based resin and a method for manufacturing the same.

SOLUTION: This curable resin composition uses as the essential components an epoxy resin (A) and an ester-based resin (B) which has in the molecular structure a skeleton having a knot of a naphthalene structure and a cyclohexadienone structure via a methylene group and has an acyloxy group as a substituent group on the naphthalene structure.

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