| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having high glass transition temperature, excellent heat resistance, and low thermal expansion properties, and an insulating film with a support, a prepreg, a laminated board and a multilayer printed wiring board using the same. SOLUTION: The thermosetting insulating resin composition includes: (A) a setting agent containing a compound having an acidic substituent and N-substituted maleimide group which is obtained by reacting (a) a diamine compound having a sulfur atom on the main chain in its molecule, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and (c) a monoamine compound, in an organic solvent; (B) an epoxy resin having at least two epoxy groups per molecule; and (C) a phosphorus compound imparting flame retardancy. COPYRIGHT: (C)2011,JPO&INPIT
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