| 摘要 |
An electronic component mounting apparatus 1 includes a substrate conveyance mechanism 14 for conveying substrates 13 and 13a; a first drawing head 4 for supplying the substrate 13 with paste at a mounting position; a second drawing head 5 for supplying the paste to the substrate 13a at a pre-paste supply position closer to a conveyance starting side rather than to the mounting position; and a bonding head 3 that mounts, at the mounting position, electronic components on the substrate 13a supplied with the paste at the pre-paste supply position.
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