| 摘要 |
PURPOSE: A semiconductor package is provided to form a gap-fill member in a gap between adjacent semiconductor chips. CONSTITUTION: A semiconductor chip has a rectangular parallelepiped with a long side(LS) and a short side(SS). The semiconductor chip has a first surface and a second surface. The semiconductor chip includes a circuit unit, a bonding pad, and a protrusion unit(150). The protrusion unit is integrated with the semiconductor chip. A penetration electrode(200) penetrates the first and second sides of the semiconductor chips. |
