发明名称
摘要 In accordance with the invention, a light emitting device includes a substrate, a layer of first conductivity type overlying the substrate, a light emitting layer overlying the layer of first conductivity type, and a layer of second conductivity type overlying the light emitting layer. A plurality of vias are formed in the layer of second conductivity type, down to the layer of first conductivity type. The vias may be formed by, for example, etching, ion implantation, or selective growth of the layer of second conductivity type. A set of first contacts electrically contacts the layer of first conductivity type through the vias. A second contact electrically contacts the layer of second conductivity type. In some embodiments, the area of the second contact is at least 75% of the area of the device. In some embodiments, the vias are between 2 and 100 microns wide and spaced between 5 and 1000 microns apart.
申请公布号 JP4564726(B2) 申请公布日期 2010.10.20
申请号 JP20030168636 申请日期 2003.06.13
申请人 发明人
分类号 H01L21/28;H01L33/38;H01L29/41;H01L33/08;H01L33/32 主分类号 H01L21/28
代理机构 代理人
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