发明名称
摘要 <p>An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered.</p>
申请公布号 JP4567775(B2) 申请公布日期 2010.10.20
申请号 JP20080217062 申请日期 2008.08.26
申请人 发明人
分类号 H03H9/25;H03H3/08 主分类号 H03H9/25
代理机构 代理人
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