发明名称 |
Composition of polycyanate ester and biphenyl epoxy resin |
摘要 |
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
|
申请公布号 |
US7816430(B2) |
申请公布日期 |
2010.10.19 |
申请号 |
US20050529738 |
申请日期 |
2005.03.30 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MIZUNO YASUYUKI;FUJIMOTO DAISUKE;SHIMIZU HIROSHI;KOBAYASHI KAZUHITO;SUEYOSHI TAKAYUKI |
分类号 |
C08K5/01;B32B15/08;C08G59/40;C08G73/06;C08K5/07;C08L63/00;C08L79/04;C08L101/02;H05K1/03 |
主分类号 |
C08K5/01 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|