LEAD FRAME, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A method for manufacturing a lead frame, the lead frame manufactured by the same, a method for manufacturing a semiconductor package, and the semiconductor package manufactured by the same are provided to improve the reliability of the semiconductor package by forming a silicon oxide film on the lead frame. CONSTITUTION: A lead frame(100) includes a die pad(110) and a lead part(120). The lead part is connected with the electrode pad and the bonding wire(220) of a semiconductor chip(200). The bonding wire is electrically connected with the semiconductor chip and the lead part. The semiconductor chip is sealed with a molding resin(250). The molding resin protects the semiconductor chip from the external impact and contamination.