Adhesive-assembly method of flexible substrate for fastening onto base structure, comprises applying adhesive to base structure with layer thickness, placing substrate on adhesive and pressing substrate by reducing adhesive layer thickness

摘要

The adhesive-assembly method of a flexible substrate (2) for fastening onto a base structure (4), comprises applying a silicone adhesive (5) to the base structure with a layer thickness, placing the substrate on the adhesive, and pressing the substrate by reducing the layer thickness of the adhesive in an areawise manner, where the pressing step takes place by pressure of the gases planarly acting on the substrate or an area of the substrate. The gas acts on the substrate with surface pressure, and is an ambient air. The pressing step takes place by vacuum pressure impingement. The adhesive-assembly method of a flexible substrate (2) for fastening onto a base structure (4), comprises applying a silicone adhesive (5) to the base structure with a layer thickness, placing the substrate on the adhesive, and pressing the substrate by reducing the layer thickness of the adhesive in an areawise manner, where the pressing step takes place by pressure of the gases planarly acting on the substrate or an area of the substrate. The gas acts on the substrate with surface pressure, and is an ambient air. The pressing step takes place by vacuum pressure impingement. An area of the substrate and the base structure and/or a carrier structure bearing the base structure is sealed against the gas for vacuum pressure impingement. A distance holder (8) is arranged between the substrate and the base structure, and is embedded in the adhesive. The substrate is a low temperature co-fired ceramic-domain-specific hypothesis substrate. The silicone adhesive is heat-impacted for hardening. The base structure is a base plate. The carrier structure is a workpiece carrier. An independent claim is included for a substrate arrangement.