Surface-mountable component, has solderable connection pads arranged on side of carrier for surface-mounting of component, where side of carrier faces chip and connection pads are connected to chip via connecting lines

摘要

The component has a chip carrier module (10) with a carrier (100) and a chip (200), where the carrier is made of flexible material. The chip includes a contacting side and a sensor. The chip is mounted on the carrier with the contacting side during flip-chip-assembly. Solderable connection pads are arranged on a side of the carrier for surface-mounting of the component, where the side of the carrier faces the chip and the connection pads are connected to the chip via connecting lines (310). An optically transparent intermediate layer (400) is arranged between the carrier and the chip. An independent claim is also included for a method for producing a chip carrier module.