| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent moldability, high thermal conductivity when compounded with an inorganic filler to form a composite, and giving a molded product having low thermal expansion and excellent heat resistance and moisture resistance, and to provide a molded product using the composition. SOLUTION: The epoxy resin composition essentially comprises an epoxy resin and a curing agent, or an additional inorganic filler, wherein an epoxy resin having an oxymethylene group is used, as an epoxy resin component, by not less than 50 wt.% in the epoxy resin component, and a bifunctional phenolic compound is used, as the curing agent component, by not less than 50 wt.% in the curing agent component. COPYRIGHT: (C)2011,JPO&INPIT |
