| 摘要 |
<p>A solder bath, inside which a primary jet nozzle and a secondary jet nozzle are disposed, is filled with molten Sn-Ag-Cu solder; the primary jet nozzle spouts molten solder in a disturbed state and the secondary jet nozzle spouts molten solder in a placid state, causing tiny pieces of tin oxide to float to the surface of the molten solder. By reducing the formation of solder dross, which forms when molten solder gets bound up with tin oxide, this increases the solder utilization rate.</p> |
